Ansys collaborates with Microsoft to advance innovation with chip development, simulation and cloud computing


3rd Gen AMD EPYC™ processors with AMD 3D V-Cache™ technology — available on Microsoft Azure HBv3 virtual machines (VMs) — will be offered to Ansys Cloud customers in 2022


  • Ansys Cloud will automatically upgrade to offer AMD EPYC 7003 Series processors with AMD 3D V-Cache technology today
  • 3rd Gen AMD EPYC processors with AMD 3D V-Cache use 3D stacking technology to deliver fantastic performance for technical computing workloads

PITTSBURGH, March 21, 2022 /PRNewswire/ — Ansys (NASDAQ:ANSS) customers will have automatic cloud access to the latest 3rd Gen AMD EPYC processors with AMD 3D V-Cache technology, available in Microsoft Azure HBv3 virtual machines. Ansys Cloud, the managed cloud service provided by Ansys and enabled on Azure, will be automatically upgraded to provide the ability to use the latest AMD chips today.

Designed specifically to accelerate computer-aided engineering (CAE) workflows, the new Azure HBv3 virtual machines with 3rd Gen AMD EPYC Processors with AMD 3D V-Cache technology deliver unprecedented performance gains for technical computing workloads. In early testing by Azure, the company saw up to 80% improvement in large-scale computational fluid dynamics (CFD) simulations and up to 50% improvement in crash tests. explicit finite element analysis (FEA). This means Ansys Cloud customers can resolve CAE issues much faster, enabling better design decisions to be made in less time.

“There is more demand than ever for high performance computing. At AMD, we continue to strive to provide our partners and customers with the right processor to support the right workload, and the 3rd Gen AMD EPYC processors with AMD 3D V-Cache technology do it for technical workloads,” said Ram Peddibhotla, vice president, EPYC product management, AMD. “We are excited to work with Azure and Ansys to create a solution that delivers fantastic performance for technical workloads. like CFD, FEA and more.”

“The incredible performance improvement of HBv3 virtual machines on Azure is unprecedented, and it is especially gratifying to see this made possible by the innovative 3D memory stacking implemented by AMD,” said Shane Emswiler, senior vice president of products at Ansys. “This is truly a virtuous circle for Ansys, and it will give our customers the confidence to move more of their simulation workloads to the cloud to reap the performance gains as soon as possible.”

“Across every industry and research community, innovation is now a computational issue, which means advancements in HPC are now more strategically important than ever for Microsoft Azure customers,” said Evan Burness, Senior Program Manager for HPC, Microsoft Azure. “By working closely with Ansys, we are able to quickly bring 3rd Gen AMD EPYC processors with AMD 3D V-Cache in Azure’s most popular HPC virtual machine, HBv3, to benefit all Ansys Cloud customers. It’s a powerful combination of software tools and one of the most powerful HPC solutions available.”

Once released, Ansys Cloud customers can easily select HBv3 as their VM option; no further action will be required for the upgrade.

About Ansys

If you’ve ever seen a rocket launch, flown in an airplane, driven a car, used a computer, touched a mobile device, walked across a bridge, or put on wearable technology, chances are you’ve used a product where Ansys software played a vital role in its creation. Ansys is the world leader in engineering simulation. Through our pervasive engineering simulation strategy, we help the world’s most innovative companies bring radically better products to their customers. By offering the best and broadest portfolio of engineering simulation software, we help them solve the most complex design challenges and create products limited only by imagination. Founded in 1970, Ansys is headquartered south of Pittsburgh, PennsylvaniaUnited States Visit for more information.

Ansys and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are either registered trademarks or trademarks of ANSYS, Inc. or its affiliates in United States or other countries. All other brand, product, service and feature names or trademarks are the property of their respective owners.

AMD, the AMD Arrow logo, EPYC, AMD 3D V-Cache technology, and combinations thereof are trademarks of Advanced Micro Devices, Inc.



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